- Description
-
Details
Features and Advantages
1. Miniaturized equipment, easy to install and operate.
2. Applicable to Chip, LED, BGA/CSP, Wafer, SOP/QFN, SMT and PTU packaging, Sensors, Connectors, and Precision Castings inspection.
3. High resolution design to get the best image in a very short time.
4. Infrared automatic navigation and positioning function can select the shooting location quickly.
5. CNC inspection mode which can quickly and automatically inspect multi-point array.
6. Inclined multi-angle inspection makes it easier to inspect sample defects.
7. Simple softwareoperation, low operating costs.
8. Long lifespan.
X-Ray Tube SourceType
Sealed Micro-Focus X-Ray Tube
Voltage Range40 - 90 kV
Current Range10 - 200 μA
Max Output Power8 W
Micro Focus Spot Size15 μm
Flat Panel Detector
TypeTFT Industrial Dynamic FPD
Pixel Matrix768 x 768
Field of View65 × 65 mm
Resolution5.8 Lp/mm
Frame (1×1)40 fps
A/D Conversion Bit16 bits
Equipment
DimensionsL850 x W1000 × H1700 mm
Input Power220V, 10A / 110V,15A 50-60HZ
Max Sample Size280 × 320 mm
Control SystemIndustrial PC WIN10 64bits
Net WeightAbout 750 kg - Reviews
-
Feature